CEVA, Broadcom Integrated, and VisiSonics Release 3D Spatial Audio Reference Design for Headphones and TWS Earbuds
The three companies jointly bring a complete 3D spatial audio hardware and software solution to consumer electronics OEMs and ODMs.
 

CEVA, a leading licensor of wireless connectivity and smart sensing technologies (NASDAQ: CEVA), together with Beken Corporation, a major player in wireless communication solutions, and VisiSonics, a leader in 3D spatial audio technology, have announced the availability of a complete 3D audio reference design that enables rapid deployment of spatial audio-supporting headphones and True Wireless Stereo (TWS) earbuds for gaming, multimedia, and conferencing applications.
This reference design leverages Beken's BK3288X Bluetooth audio SoC series, which includes the CEVA-X2 audio DSP capable of running VisiSonics' RealSpace® 3D audio software, as well as CEVA's MotionEngine™ Hear head tracking algorithm. This highly optimized hardware and software solution offers OEMs and ODMs a cost-effective and rapidly deployable SoC with industry-leading performance that can work with any audio encoding format, introducing a best-in-class 3D audio listening experience for VR, AR, and next-generation motion-aware earbuds. This single-chip based reference design provides a self-contained 3D audio solution that resides entirely within the headphones, eliminating the need for a 3D audio rendering engine on the host device, thus achieving a lower latency design.

Dr. Ramani Duraiswami, CEO of VisiSonics, said, "We are excited to collaborate with CEVA and Beken to create a reference design that includes our leading RealSpace 3D audio technology. This joint reference design offers consumer electronics OEMs and ODMs a complete hardware and software solution to add 3D spatial audio technology to their headphone and TWS earbud product lines."
Weifeng Wang, Vice President of Engineering Technology at Beken Corporation, said, "Over the past decade, we have been at the forefront of wireless audio innovation, powering hundreds of millions of Bluetooth-enabled audio devices. Spatial audio technology can elevate the wireless audio user experience to new levels. We are delighted to collaborate with CEVA and VisiSonics to provide an affordable and energy-efficient turnkey product that allows our customers to easily harness this exciting new technology. We look forward to seeing innovative use cases in the mass market that drive the audio, gaming, and AR/VR industries forward with spatial audio."
Moshe Sheier, Vice President of Marketing at CEVA, said, "As the Android and PC ecosystems seek to harness the industry momentum for spatial audio to create immersive audio experiences in music and gaming, spatial audio has become a very hot market. Our collaboration with Beken and VisiSonics is aimed at providing a feature-rich, self-contained, and rapidly deployable spatial audio turnkey solution for headphones and earbuds, helping OEMs and ODMs meet the demands of this emerging market."

Availability
The 3D audio reference design is available directly from CEVA, with the software package combining VisiSonics RealSpace 3D audio and CEVA MotionEngine™ Hear available under license from CEVA and VisiSonics.
About VisiSonics

VisiSonics is a 3D spatial audio technology company with a complete product suite that enhances end-user performance and overall experience by adding situational or spatial awareness, reducing listener fatigue, and improving response times. Our products include 3D audio rendering, capture, and analysis, personalization software, and acoustic visualization and measurement solutions. VisiSonics' physics-based RealSpace 3D audio technology is licensed to consumer electronics brands, semiconductor manufacturers, and game developers.

About Beken Corporation
Established in December 2004 by a technical team from Silicon Valley, USA, Beken Corporation focuses on smart transportation and smart home applications and is a well-known listed company in the field of IoT wireless connection chip design in China.
After 16 years of product and technology accumulation, Beken has a comprehensive wireless communication product platform that supports a rich set of wireless protocols and communication standards. The company provides low-power and high-performance wireless connection system-on-chip (SoC) products to domestic and international customers, including many world-renowned brands, for radio frequency receivers and transmitters as well as integrated microprocessors, and offers complete wireless communication solutions for smart transportation, IoT, and other applications.

About CEVA, Inc.
CEVA is a leading licensor of wireless connectivity and smart sensing technologies, committed to building a more intelligent and secure connected world. We offer digital signal processors, AI engines, wireless platforms, encryption cores, and associated software for sensor fusion, image enhancement, computer vision, voice input, and AI applications. CEVA provides these technologies along with Intrinsix turnkey chip design services to help customers tackle their most complex and time-sensitive integrated circuit design projects. Using our technologies and chip design skills, many of the world's leading semiconductor companies, system companies, and OEMs create power-efficient, intelligent, and secure connected devices for the mobile, consumer, automotive, robotics, industrial, aerospace & defense, and IoT end markets.
CEVA's DSP-based solutions